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120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

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120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

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Brand Name : HSF

Model Number : 120DG-DS1030-LPE

Place of Origin : China

MOQ : 10000㎡

Payment Terms : T/T, L/C

Supply Ability : 80000kg per week

Delivery Time : within 10 days

Packaging Details : PE wrapping film + Bubble Film + Wooden pallet (Standard 1100mm x 1100mm x 100mm)

Material : Low Density Polyethylene

Color : Dark Green, customized

Halogen free : Yes

Thickness : 120 ± 5μm, customized

Width : 1300 -0 ~ +6mm, customized

Core : 3" or 6"

Coating : Double Side UV Cured Silicone Coating

Release Force : Side A 5-10gf, Side B 20-30gf, the ratio of release force can be customized

Subsequent Adhesion Rate : ≥75%

Length : 1800m ± 200m, customized

Splice : ≤1

Sample : A4 sheet for free

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LDPE Release Film, D, 120micron, DG, UV Cured, Application of Tape, Sealing strip, No solvent or silicone transfer.

1 Appearance No air bubbles / stains / breakage / impurities Measured data (Ref.)
2 Size Width (mm) 1000 -0+6 1004
Thickness (mm) 0.120 ± 8% 0.116
3 Max. Tension (N / 50mm) TD ≥ 15 20
MD ≥ 15 21
4 Color difference Colorimeter △E ＜ 3 ok
5 Elongation @ break (%) TD ≥ 230 876
MD ≥ 230 754
6 Surface Tension (Corona treatment) Dyne Value ≥42 dyne 48
7 Release Force (gf/25mm 20min.Finat 10) Inner 5-10 7
Outer 20-30 24
8 Subsequent Adhesion (%) Inner ≥75 88
Outer ≥75 90
9 Winding direction Customized -
10 Splice No. ≤1 -

LDPE (high pressure low density polyethylene):

Non-toxic, tasteless, odorless, translucent spherical or cylindrical particles, excellent low temperature resistance.

chemical resistance, good extensibility, electrical insulation, but poor wetness, Flammable.

Density: 0.910—0.9408G/CM3 (g/cm3), suitable for extrusion, blister, injection molding, vacuum, molding, and conversion

molding and other processing methods. The crystallinity is 55-65%, and the crystal melting point is 108-126 °C.

120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application


Product Tags:

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Quality 120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application wholesale

120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application Images

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